Patent · US Active

Method for producing a power semiconductor module, and power semiconductor module comprising a connection device

US8283784B2 · kind B2 · utility

2Cited by

3References

9Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Peter Beckedahl · Oberasbach, DE
Markus Knebel · Tuchenbach, DE
Thomas Stockmeier · Baden, CH

Key dates

Filing date	Jun 9, 2010
Grant date	Oct 9, 2012
Priority date	—
Expiry date	Aug 25, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16195
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.