Electrical interconnection structures and method
US8285379B2 · kind B2 · utility
1Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2006 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | Jan 7, 2029 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3754
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.