Wireless communication with a medical implant
US8285387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2008 |
| Grant date | Oct 9, 2012 |
| Priority date | — |
| Expiry date | May 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/30
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.