Method and apparatus for making a radio frequency inlay

US8286332B2 · kind B2 · utility

Assignee

• HID Global Corp. · DE

Inventors

• Ulrich Lang · San Francisco, US
• Lionel Carre · Seeg, DE
• Viroel-Marian Hasegan · Fussen, DE
• David Finn · Tourmakeady, IE

Key dates

• Filing date: Sep 24, 2007
• Grant date: Oct 16, 2012
• Expiry date: Jun 2, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49169
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit such that the wire may be subject to further processing, such as removing insulation without potentially damaging the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. Methods of the invention include forming loops with the wire ends wherein the loops extend above a plane of the substrate, and in another processing step, the loops are displaced to be electrically connected to the terminal areas. Methods also include repositioning the wire and using a brush or comb device.