Method of assembling a thermal expansion compensator
US8286335B2 · kind B2 · utility
1Cited by
13References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2011 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Jul 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.