Patent · US Active

Method of manufacturing a wiring board

US8286341B2 · kind B2 · utility

2Cited by

4References

8Claims

0Family size

Assignee

Imbera Electronics Oy · FI

Inventors

Petteri Palm · Regensburg, DE
Arni Kujala · Espoo, FI

Key dates

Filing date	Apr 8, 2009
Grant date	Oct 16, 2012
Priority date	—
Expiry date	Sep 7, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49146
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.