Enhanced thermoelectric cooler with superconductive heat-dissipative device for use in air-conditioners
US8286436B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Feb 11, 2011 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Feb 11, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2321/025
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.