Dispensing systems for dispensing a heated liquid
US8286833B2 · kind B2 · utility
0Cited by
21References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2010 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Sep 17, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems for dispensing heated liquids, such as hot melt adhesives. The dispensing system may include a hot air manifold and a liquid manifold with a surface confronting surfaces of the air manifold to define an air plenum. A dispensing module is coupled in fluid communication with the liquid manifold and in fluid communication with an air outlet of the hot air manifold. The dispensing module is capable of dispensing the heated liquid and is capable of receiving and dispensing the process air to impinge upon the heated liquid. A heating element is operative for heating the process air flowing through said air plenum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.