Glass member provided with sealing material layer, and electronic device using it and process for producing the electronic device
US8287995B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2011 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | May 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention seeks to increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing. A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 comprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer 5 and contains low-expansion filler particles having particle sizes within a range of from 0.5T to 1T based on the thickness T of the sealing material layer 5 in a volume ratio of from 0.1 to 50%. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element are laminated, and the sealing material layer 5 is irradiated with a laser light 6 and melted to bond the glass substrates 2 and 3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.