Photosensitive resin composition, and pattern formation method using the same
US8288078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2008 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | May 30, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition is provided that is highly safe, provides a coating film having superior uniformity, can improve the curing density of the cured resin pattern, and is capable of forming a micro resist pattern having a large film thickness and a high aspect ratio with high sensitivity and high resolving ability. According to a photosensitive resin composition including, in addition to an onium fluorinated alkyl fluorophosphate based cation polymerization initiator having a specific structure, a specified solvent or a specified sensitizing agent as essential components, a coating film having superior uniformity, can improve the curing density of the cured resin pattern, and also is capable of forming a micro resist pattern having a large film thickness and a high aspect ratio with high sensitivity and high resolving ability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.