Semiconductor devices with conductive clips
US8288200B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 30, 2005 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Jan 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0665
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is described that includes a die connected between a conductive platform and a conductive clip. The semiconductor device is formed by a process that includes mounting a first surface of each of multiple die to each of a number of conductive mounting platforms of a lead frame structure. The process also mounts a clip structure to the lead frame structure, the clip structure including a number of conductive clips. Mounting of the clip structure to the lead frame structure includes aligning each of the conductive clips with corresponding ones of the conductive mounting platforms so that a portion of each of the conductive clips contacts a second surface of a corresponding die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.