Method for making an electric interconnection between two conducting layers
US8288267B2 · kind B2 · utility
1Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2010 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Oct 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making an electric interconnection between two conducting layers, separated by at least one insulation or semi-conducting layer, which includes forming a stud extending between at least the lower conducting layer and the upper conducting layer, where the nature and/or the shape of the stud impart non-wettability properties relative to the material used for the separating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.