Process to disperse organic microparticles/nanoparticles into non-aqueous resin medium
US8288453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2009 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Nov 4, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process to disperse organic microparticles/nanoparticles into non-aqueous resin medium is provided. The process includes the steps of a) preparing a resin dispersion/emulsion in water and/or solvent where the resin contains unsaturation in the polymer chain and optionally comprises an ethylenically unsaturated monomer; b) curing the resin dispersion/emulsion by adding monomer and/or initiator; and c) adding the cured dispersion/emulsion during a synthesis step of a resin medium. The amount of organic microparticles/nanoparticles in the resin medium can be about 2 to about 30% by weight based on the total weight of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.