Low temperature curable photosensitive resin composition and dry film manufactured by using the same
US8288656B2 · kind B2 · utility
1Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2010 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Apr 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.