Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
US8288681B2 · kind B2 · utility
8Cited by
27References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2006 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Aug 10, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13439
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus is provided. The laser processing apparatus removes and extracts debris generated by irradiating a transparent resin layer formed on a substrate with laser light during a patterning process, and includes a debris extraction module provided on the upper side of the substrate, wherein the debris extraction module sucks and extracts debris due to sublimation, thermal processing and composite action thereof generated from the transparent resin layer on the substrate irradiated with the laser light from the lower side thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.