Power management integrated circuit
US8288846B2 · kind B2 · utility
18Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2010 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Feb 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.