Encapsulation for an organic electronic component, its production process and its use

US8288861B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Dirk Buchhauser · Tangxia, CN
• Debora Henseler · Erlangen, DE
• Karsten Heuser · Erlangen, DE
• Arvid Hunze · Erlangen, DE
• Ralph Paetzold · Roth, DE
• Wiebke Sarfert · Herzogenaurach, DE
• Carsten Tschamber · Hamburg, DE

Key dates

• Filing date: Apr 13, 2005
• Grant date: Oct 16, 2012
• Expiry date: Jul 4, 2026

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/239

Abstract

An encapsulation for an organic electronic component, characterized in that the component, encapsulated in a dimensionally stable capsule, is at least partially covered with a protective film.