Patent · US Active

Microwave module

US8288864B2 · kind B2 · utility

0Cited by

7References

4Claims

0Family size

Assignee

Rohde & Schwarz GmbH & Co. KG · DE

Inventors

Werner Perndl · Vaterstetten, DE
Thomas Reichel · Heroldsbach, DE

Key dates

Filing date	Mar 10, 2009
Grant date	Oct 16, 2012
Priority date	—
Expiry date	Aug 24, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a microwave module with at least one semiconductor chip, which provides on its upper side a connecting-line structure formed in particular as a coplanar line, which is connected to at least one adjacent incoming and/or outgoing line structure formed on the upper side of the substrate, the chip is glued with its underside and all lateral surfaces, on which no high-frequency connecting lines lead to the chip, within a recess of a metal part with good thermal conduction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.