Semiconductor integrated circuit device which has first chip and second chip accessed via the first chip and test method thereof
US8289041B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2008 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Jan 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device includes a first chip including an internal circuit, and a second chip capable of being accessed only via the first chip, and a test processor circuit electrically connected internally via the first chip, for accessing the second chip from an external terminal and testing the second chip, and a test circuit where an input/output buffer is installed for signals for accessing the second chip within the test processor circuit, and a bypass line installed for transferring signals from the first chip to the second chip and avoiding the input/output buffer within the test processor circuit, and a switch which switches between signal transfer path via the input/output buffer, and a signal transfer path via the bypass line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.