Liquid cooling systems for server applications
US8289710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Sep 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20772
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force applied to the two heat exchangers. The mounting mechanism may include an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server to lessen the possibility of disconnecting the electrical connections between the electronics server and the rack, and/or lessening mechanical stresses transferred to the electronics server and the rack chassis. The mounting mechanism also may be coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.