Microalignment using laser-softened glass bumps
US8291729B2 · kind B2 · utility
11Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2008 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Nov 30, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2204/08
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a method for fabricating glass bump standoff structures of precise height, the method comprising providing oversized glass bumps on a glass substrate, providing a heat source to heat the bumps, positioning a substrate to be aligned on the oversized bumps, and reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.