Patent · US Active

Double laser drilling of a printhead integrated circuit attachment film

US8293057B2 · kind B2 · utility

0Cited by

2References

17Claims

0Family size

Assignee

Zamtec Ltd · IE

Inventors

Nagesh Ramachandra · Sydney, AU
Jennifer Mia Fishburn · Sydney, AU
Paul Timothy Sharp · Sydney, AU
Susan Williams · Sydney, AU
Paul A. Papworth · Wappingers Falls, US
Simon Fielder · Sydney, AU
Kia Silverbrook · Sydney, AU

Key dates

Filing date	Mar 17, 2008
Grant date	Oct 23, 2012
Priority date	—
Expiry date	Aug 24, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1084
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method of fabricating an apertured polymeric film. The method comprising the steps of: (a) masking a polymeric film with a first mask having first laser transmission zones defined therein; (b) laser-ablating first apertures through the polymeric film using the first mask; (c) masking the film with a second mask having second laser transmission zones defined therein, each second zone being aligned with a corresponding first aperture, and each second zone having greater perimeter dimensions than the corresponding first aperture; and (d) reaming the first apertures by laser-ablating the polymeric film using the second mask, the reamed first apertures defining second apertures in the film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.