Patent · US Active

Process for preparation of copper containing molecular sieves with the CHA structure, catalysts, systems and methods

US8293199B2 · kind B2 · utility

21Cited by
46References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 16, 2010
Grant dateOct 23, 2012
Priority date
Expiry dateDec 16, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02C20/10
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

Disclosed are processes for the preparation of copper containing molecular sieves with the CHA structure having a silica to alumina mole ratio greater than about 10, wherein the copper exchange step is conducted via wet state exchanged and prior to the coating step and wherein in the copper exchange step a liquid copper solution is used wherein the concentration of copper is in the range of about 0.001 to about 0.25 molar using copper acetate and/or an ammoniacal solution of copper ions as copper source. Catalysts made by the processes, catalyst systems and methods of treating exhaust gas with the molecular sieves and catalysts are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.