Thin metal film conductors and their manufacture
US8293323B2 · kind B2 · utility
0Cited by
30References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2007 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Aug 30, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Metal solutions such as copper and nickel suitable for chemical solution deposition (CSD) are disclosed, and their manufacture into low resistivity thin metal films is disclosed. The films may be thermal processed at relatively low temperatures and may be co-fired with ultra low fire high K ceramic dielectrics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.