Device housing and method for making the same
US8293345B1 · kind B1 · utility
1Cited by
0References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 23, 2011 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Aug 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1317
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A device housing is described. The device housing includes an aluminum alloy substrate and a compound corrosion resistant layer formed on the substrate. The compound corrosion resistant layer includes two crystalline films and a non-crystalline film formed between the crystalline films. One of the crystalline films is formed on the substrate. The crystalline film is a chromium-oxygen-nitrogen film or an aluminum-oxygen-nitrogen film. The non-crystalline film is an aluminum oxide film or a silicon dioxide film. A method for making the device housing is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.