Resin composition for stereolithography
US8293448B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 15, 2007 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Jan 7, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/038
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a resin composition for stereolithography that absorbs little water and moisture over time in uncured state, maintains a low moisture absorption rate even under high humidity, and has high curing sensitivity, from which a stereolithography product excellent in the properties, such as dimensional accuracy, mechanical properties, and dimensional stability can be smoothly produced for reduced light irradiation time. The resin composition for stereolithography comprising an oxetane compound expressed by the general formula (I) below:wherein R1 denotes an alkyl group having 1 to 5 carbon atoms, and R2 denotes an alkylene group having 2 to 10 carbon atoms that may contain an ether bond, in the proportion of from 3 to 60 mass % based on the total mass of the resin composition for stereolithography.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.