Direct emulsion process for making printed circuits
US8293461B2 · kind B2 · utility
0Cited by
6References
8Claims
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Assignee
Inventor
Key dates
| Filing date | Jun 18, 2008 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Jun 18, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A direct emulsion process for making printed circuits and printed circuit boards which includes coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, imaging the coated substrate with a circuit design, developing the imaged substrate, and directly plating the developed image onto the coated substrate. Coating solutions which work particularly well in this process include a ferric oxalate and palladium emulsion or a silver based emulsion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.