Patent · US Active

Solder resist coating for rigid-flex circuit boards and method of producing the solder resist coating

US8294031B2 · kind B2 · utility

8Cited by
7References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 1, 2010
Grant dateOct 23, 2012
Priority date
Expiry dateAug 20, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24273
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.