Solder resist coating for rigid-flex circuit boards and method of producing the solder resist coating
US8294031B2 · kind B2 · utility
8Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2010 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Aug 20, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24273
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.