On-wafer butted microbolometer imaging array
US8294099B2 · kind B2 · utility
189Cited by
9References
20Claims
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Key dates
| Filing date | Apr 9, 2010 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Apr 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
Abstract
An apparatus and method for assembling a large microbolometer infrared imaging array from sub-arrays, including the step of forming a sub-array assembly of independent imaging arrays on the silicon wafer as the imaging sensor is being processed, whereby seams or gaps in a resulting image are avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.