Semiconductor package
US8294255B2 · kind B2 · utility
8Cited by
1References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 8, 2010 |
| Grant date | Oct 23, 2012 |
| Priority date | — |
| Expiry date | Dec 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor package includes a printed circuit board, a first semiconductor chip, and a second semiconductor chip. The printed circuit board includes a slot. The first semiconductor chip is mounted on the printed circuit board to cover a first part of the slot. The second semiconductor chip is mounted on the printed circuit board to cover a second part of the slot separate from the first part. The first semiconductor chip is substantially coplanar with the second semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.