Wafer positioning system

US8296937B2 · kind B2 · utility

Assignee

• Silverbrook Research Pty Ltd · AU

Inventors

• David Burke · Chatswood, AU
• Jan Waszczuk · Sydney, AU
• Desmond Bruce Boyton · Sydney, AU
• Craig Donald Strudwicke · Sydney, AU
• Peter John Morley Sobey · Sydney, AU
• William Granger · Sydney, AU
• Jason Mark Thelander · Chatswood, AU
• Eric Patrick O'Donnell · Sydney, AU

Key dates

• Filing date: Aug 19, 2008
• Grant date: Oct 30, 2012
• Expiry date: Nov 14, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/53265
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention provides an assembler for constructing a pagewidth inkjet printhead by assembling inkjet ICs on a carrier having tortuous ink supply paths to each IC. The assembler supports and positions a diced wafer having the inkjet ICs, and picks and conveys a predetermined plurality of the ICs from the wafer to be sequentially placed across the carrier thereby constructing the pagewidth printhead. A die placement assembly of the assembler receives a clamp assembly's elongate body which has a pair or elongate retaining plates, an insert below the plates, and a diaphragm which receives the carrier and is pneumatically displaceable to urge the insert against the plates. A base/plate of the assembler's wafer positioning assembly has stages, one of which rotatably mounts a support plate which receives the wafer and has a motor which rotates the support plate underneath the assembler's die picker under control of the assembler's controller.