Space-saving high-density modular data pod systems and energy-efficient cooling systems
US8297067B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2011 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Dec 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20818
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A space-saving, high-density modular data pod system and an energy-efficient cooling system for cooling electronic equipment and method of cooling are disclosed. The cooling system includes a free-cooling system cooling a first fluid in thermal communication with the electronic equipment using atmospheric air and a mechanical sub-cooling system coupled to the free-cooling system. The mechanical system cools a second fluid flowing in the free-cooling system as a function of an amount by which the free-cooling system has exceeded its maximum cooling capacity. The method of cooling includes using a first fluid, enabling heat transfer from the first fluid to a second fluid that has been cooled using atmospheric air, and mechanically cooling the second fluid to the extent that free cooling the first fluid is insufficient to cool the first fluid. The cooling system operates by the wet bulb temperature exceeding a first predetermined wet bulb temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.