Pressure sensor with low cost packaging
US8297127B2 · kind B2 · utility
28Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2011 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Jan 7, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0084
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor is disclosed that may include a minimum amount of fluid coupling packaging. In one illustrative embodiment, a pressure sensor assembly may include a pressure sensor die having a front side and a back side, and a pressure sensing diaphragm. The pressure sensor assembly may further include a housing having a mounting side and a sensing side. The sensing side may define a pressure port. The pressure sensor die may be secured to the housing such that the pressure sensing diaphragm is exposed to the pressure port, and such that front side of the pressure sense die is accessible from outside of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.