Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
US8299369B2 · kind B2 · utility
0Cited by
25References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2009 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Oct 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.