Selective thermal conditioning components on a PCB
US8299393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2010 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Apr 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.