Drive apparatus and semiconductor module
US8299664B2 · kind B2 · utility
7Cited by
8References
51Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 24, 2010 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Nov 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K2211/03
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.