Circuit substrate for mounting electronic component and circuit substrate assembly having same
US8300420B2 · kind B2 · utility
8Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2009 |
| Grant date | Oct 30, 2012 |
| Priority date | — |
| Expiry date | Mar 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.