Micro-bump forming apparatus
US8302838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2011 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | May 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.