Device for assembling components having metal bonding pads
US8302839B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jun 17, 2009 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Apr 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device for assembling components having metal bonding pads includes plates that can move relative to each other, bearing metal components respectively and leaving between them a flat chamber surrounding the components when the latter are in contact with each other. The flat chambers can be saturated with deoxidizing gaseous fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.