Closed loop wire bonding methods and bonding force calibration
US8302840B2 · kind B2 · utility
7Cited by
11References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Oct 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.