Apparatus and method for electrochemical processing of thin films on resistive substrates
US8303791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2008 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Jul 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.