Patent · US Active

Use of a polyamide molding composition with high melt stiffness for coextrusion with a high-melting-point polymer

US8303873B2 · kind B2 · utility

9Cited by

44References

14Claims

0Family size

Assignee

EVONIK DEGUSSA GMBH · DE

Inventors

Andreas Dowe · Borken, DE
Rainer Göring · Borken, DE
Michael Boer · Johannesweg, DE
Roland Wursche · Schneverdingen, DE
Martin Himmelmann · Haltern, DE
Franz-Erich Baumann · Schneverdingen, DE
Karl Kuhmann · Schneverdingen, DE

Key dates

Filing date	Jul 5, 2006
Grant date	Nov 6, 2012
Priority date	—
Expiry date	Sep 14, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31725
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

Multilayer composites are obtained from a molding composition which contains the following components:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.