Patent · US Active

Printed circuit board made from a composite material

US8304054B2 · kind B2 · utility

1Cited by

3References

20Claims

0Family size

Assignee

Curamik Electronics GmbH · DE

Inventors

Xinhe Tang · Wien, AT
Ka Chun Tse · Sha Tin, CN
Ernst Hammel · Wien, AT
Ben Zhong Tang · 流花街道, CN

Key dates

Filing date	Oct 17, 2011
Grant date	Nov 6, 2012
Priority date	—
Expiry date	Oct 17, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31515
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.