Carbon/epoxy resin composition and method of producing a carbon-epoxy dielectric film using the same
US8304473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2009 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Dec 3, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.