Ni-P layer system and process for its preparation

US8304658B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Juergen Barthelmes · Berlin, DE
• Robert Ruether · Oranienburg, DE
• Olaf Kurtz · Berlin, DE
• Michael Danker · Berlin, DE

Key dates

• Filing date: Mar 5, 2009
• Grant date: Nov 6, 2012
• Expiry date: Dec 25, 2029

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D3/562
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ≦3.0 μm, (ii) a Ni—P layer having a thickness ≦1.0 μm, and (iii) a Au layer having a thickness ≦1.0 μm.