Light-emitting diode module and manufacturing method thereof

US8304798B2 · kind B2 · utility

Assignee

• Light Ocean Technology Corp. · TW

Inventor

• CHIA-MIN WU · Daxi District, TW

Key dates

• Filing date: Sep 3, 2010
• Grant date: Nov 6, 2012
• Expiry date: Dec 10, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8582

Abstract

A light-emitting diode (LED) module includes a substrate, an LED, a first encapsulation element and a second light-pervious encapsulation element. The substrate has a first surface, a second surface, a circuit layer and an opening, wherein the opening penetrates through the first surface and the second surface, and the circuit layer includes at least one first conductive contact disposed on the first surface. The LED is disposed in the opening and is electrically connected to the first conductive contact. The first encapsulation element and the second light-pervious encapsulation element are respectively disposed on the first surface and the second surface, for encapsulating the LED and the first conductive contact. The aforementioned LED module may output light from the back of the LED, thereby improving the light output efficiency of the LED module. A manufacturing method of the aforementioned LED module is also herein disclosed.