Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US8304990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2010 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Sep 30, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.