Solderless electronic component or capacitor mount assembly
US8305769B2 · kind B2 · utility
3Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 20, 2009 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Oct 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solderless electronic component or capacitor mount assembly including a housing having a base portion and a cover portion is disclosed. The cover portion and base portion being couplable to each other so as to secure a capacitor to the housing. The assembly further including at least one connector configured to couple the assembly to a printed circuit board, and at least one electrical contact configured to contact a respective at least one lead of the capacitor and provide an electrical connection for the capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.