Method for placing at least one component provided with connection points on a substrate, as well as such a device
US8306313B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 2, 2008 |
| Grant date | Nov 6, 2012 |
| Priority date | — |
| Expiry date | Jan 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0815
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.