Method of forming a coupled coil arrangement
US8307534B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2012 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jan 30, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.